DEVICE_MANAGER_MAX_BONDS problem

[Nicolas Guillon]

Hi,

We are using ARM mbed compiler and the nrf51822 which has 256Kb of Flash.
We are trying to see what is the maximum bonds we could store on the nrf51822 as this is the chip we are currently using.
Our target is to store 400 bonds either on the nrf52832 (512Kb flash) or nrf52840 (1Mb Flash) depending on the memory requirement.

I have set the following:

#define PSTORAGE_NUM_OF_PAGES      25
#define DEVICE_MANAGER_APP_CONTEXT_SIZE     4
#define DEVICE_MANAGER_MAX_BONDS       200

However that configuration doesn't compile on mbed, the max value i can compile with is DEVICE_MANAGER_MAX_BONDS       120
Now when I transfer the program to the nrf51822 module, the module will hang until I reduce DEVICE_MANAGER_MAX_BONDS   to    48
With the MAX_BONDS set to 48, the module works as expected.

I have been reading that one bond requires 80B of Flash, so we should be able to store way more than 48 bonds.
Any settings that I am overlooking?

Thank you in advance for your help

[Kenneth]

Hi, I don't think the intention was that bond manager should handle this amount of bonds concurrently. From the documentation I can find:
http://infocenter.nordicsemi.com/topic/com.nordic.infocenter.sdk5.v11.0.0/lib_device_manager.html?cp=4_0_8_3_1_3 

"Currently module cannot handle more than 10 bonds." I think you will have to solve this in a different way than every device connection have a unique bond.

[Nicolas Guillon]

we are able to store 48 bonds and the limit is normally defined by the size of the flash memory.
please check the answer below, which is 4 years old:
https://devzone.nordicsemi.com/f/nordic-q-a/3773/device_manager_max_bonds-problem