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Is die temperature calibrated after the chip manufacture?

I tried to read out the temperature sensor of NRF51822. In light CPU load (turn on ADC and send data through BLE every 1s), the measured value is around 45 degC, compared to my temperature gun reading, 32 degC on the chip package surface. I know there should be some difference between die and surface, however, 45 degC seems not reasonable for this LOW POWER chip set.

I wonder whether the temp. sensor was calibrated after its fabrication? Is the reading reliable?