Save bonding information on Application Chip

[Satbir]

Hi there,

We have the application running on STM32 and we talk to connectivity chip ( nrf 52810) using serialization.

Now, I have to save bonding information on my STM32 (various reason). So I can rule out the use of Peer Manager. 

The documents say security information will be available on BLE_GAP_EVT_AUTH_STATUS in the memory provided in call sd_ble_gap_sec_params_reply.

This information shall be saved and reused in sd_ble_gap_sec_info_reply.

Now, since we are using serialization and I fear that I am not getting information on the application chip from sd_ble_gap_sec_params_reply since memory is local to application chip.

I may be wrong, Can someone point me to a working example or share their experience.

Thanks 
Satbir

[Kenneth]

Hi,

You serialize softdevice api, so sd_ble_gap_sec_params_reply() and sd_ble_gap_sec_info_reply() should not differ from other softdevice api calls and events.

I do for instance believe \nRF5_SDK_15.2.0_9412b96\examples\ble_peripheral\ble_app_hrs\pca10040\ser_s132_uart show usage of sd_ble_gap_sec_params_reply() and sd_ble_gap_sec_info_reply().

Best regards,
Kenneth

[Satbir]

Thanks Kenneth,

It worked, I realized that I missed a few flags

kdist_own.enc = 1

kdist_peer.enc = 1

Thanks again.