Dear sir,
The current BGA ball size is 0.3mm. What is the recommended VIA hole size for the inner pads for routing the signals out from IC ? or How large of the via in the demo board ?
Dear sir,
The current BGA ball size is 0.3mm. What is the recommended VIA hole size for the inner pads for routing the signals out from IC ? or How large of the via in the demo board ?
Hi,
This is well described in this whitepaper. Note that nRF52840-QIAA is not a BGA package, there are no bumps solder balls on the pins, so you need to add paste mask on the pin pads as well. This is also described in the whitepaper. All Nordic nRF52840 share the dimensions described in this document.
Best regards,
Andreas
Hi,
This is well described in this whitepaper. Note that nRF52840-QIAA is not a BGA package, there are no bumps solder balls on the pins, so you need to add paste mask on the pin pads as well. This is also described in the whitepaper. All Nordic nRF52840 share the dimensions described in this document.
Best regards,
Andreas
The link is down! Can you please indicate anothe place where we can find this information?
@Ramond which VIA size (drill and diameter) did you use ?
Hi,
Thanks for reporting, I updated it and now it should work again.
Best regards,
Andreas