bonding issue

[sruthiraj koodathil]

i was trying to implement bonding in ble_app_hrs example(SDK V6.1.0 and soft device v7.0.0) i have given params

#define SEC_PARAM_TIMEOUT                    30                                   
#define SEC_PARAM_BOND                         1                                          
#define SEC_PARAM_MITM                          1                                      
#define SEC_PARAM_IO_CAPABILITIES           BLE_GAP_IO_CAPS_DISPLAY_YESNO       
#define SEC_PARAM_OOB                            0                                          
#define SEC_PARAM_MIN_KEY_SIZE              7                                    
#define SEC_PARAM_MAX_KEY_SIZE             16   

when i tried to bond in master control panel it asks for 6 digit number with any number it shows bonded:true.... but could not get connected.

1. i have given io_capabilities as BLE_GAP_IO_CAPS_DISPLAY_YESNO , then why it asks for 6 digit number rather than yes/no.
2. why device get bonded for every number. 3.i tried in debug mode also... it shows an error .. error code 132.. what it means

[sruthiraj koodathil]

p_ble_evt->evt.gap_evt.params.passkey_display.passkey..... dis is the passkey i have to enter while bonding ryt? in dm_ble_evt_handler i have assingned array passkey[6] as {1,2,3,4,5,6}... nd try to bond by entering dis key... mcp shows bonded true.. but connection is getting lost