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sdk 1.15.3 how to set up bonding examples with DFU enabled?

Dears,

What I am trying to implement:

  1. enable MITM and bonding
  2. device IO capability:BLE_GAP_IO_CAPS_DISPLAY_ONLY; (mostly like ble_app_gls with passkey method, but different service)
  3. with DFU enabled

What I did try or failed:

  1. secure bootloader example and ble_app_buttonless_dfu example, with or without bonding, walked through and succeed
  2. trying to set ble_app_gls to add DFU services, failed in application bootup

I need some help here:

  1. Is there any procedure I can follow to add DFU feature into a current bonding example?
  2. How to set ble_app_buttonless_dfu bonding with passkey entry method?(ble_app_buttonless_dfu bonding example seems only works under JUST WORK method).
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