Hi,
Could you please provide me the Power Dissipation and Junction to case thermal resistance information for part # NRF52810-QFAA-R7
Hi,
Could you please provide me the Power Dissipation and Junction to case thermal resistance information for part # NRF52810-QFAA-R7
Hi!
We do not have a lot of documentation on this because for Ultra-Low Power application -
Tj (junction temperature) ~= Tc (case temperature) = Tambient (ambient temperature).
Some quick characterization for nRF52832 resulted in Ta = 85°C, Tj < 90°C, thermal power dissipation was 0.21 W.
The nRF52810 is effectively an optimized subset of nRF52832, so the Tj will be lower for nRF52810.
Best regards,
Heidi
Any information on θJC (°C/W)?
Since the chip does not require cooling fins, the junction to case thermal resistance value is not important.
Well this is really an on-edge arrogant answer. θJC is absolutely necessary information to get for calculations for use of the chip in specific environments such as ATEX environments.
Heidi, do you think you can provide us with any type of Tj / Tc/ Tamb / θJC information for NRF52811-QFAA so we can work with this information for calculations for ATEX environments? I am unfortunately not able to find this ingormation anywhere.
Thanks.
Hi!
I beg to differ, but please make a new ticket about this inquiry and we'll try to get you some answers.
Due to the summer holidays in Norway, you can expect a delay in your answer due to key-employees being on vacation until August 3rd.
Best regards,
Heidi
Hi!
I beg to differ, but please make a new ticket about this inquiry and we'll try to get you some answers.
Due to the summer holidays in Norway, you can expect a delay in your answer due to key-employees being on vacation until August 3rd.
Best regards,
Heidi