nRF9160 Soldering Issue

[DD_connectivity]

Hi,

Need data on Stencil, recommended solder profile & Solder paste details for nRF9160.

We are facing some issues in production.

*Critically Urgent *

thanks !

[Martin Lesund]

Some things to consider are the following:

1. Support under the PCB during the paste printing
2. Support under the PCB in the reflow oven
3. Stencil thickness
4. Hole size on pads
5. Paste type/size (T3/T4T/T5/T6 etc.)

At our lab, we have 80µm thick stencil with 15% reduction on all pads and use T5 solder paste.

[DD_connectivity]

Hi Martin,

Thanks for quick reply.

Please help to share the recommended solder profile as well ( REFLOW). Thanks.

[Martin Lesund]