aQFN73 footprint

[Hallvard@Vitir]

Hi, I am making a PCB with nRF52840-QIAA and aQFN73 footprint. Do you have available documentation showing the actual size of the balls (diameter) for this package and maybe recommended solder resist pattern and - paste stencil. I have downloaded the symbol, component and part via Mousers website, they have an option to use SamacSys' Library Loader to convert component to different CAD-libraries. It worked well and I have the part in my design. However, need to add solder resist and paste stencil openings and also would like to verify that the footprint fits the actual size of the balls. The other mechanical measures I have found and verified from datasheet.

Thank you and best regards, Hallvard

[Andreas]

Hi,

 

This Application note (html and PDF) shows general PCB guidelines for the aQFN package, in case you have not seen that. It should describe our reference pad diameter, pad paste mask diameter and pad solder mask diameter.

There are no balls on the pins of the aQFN package, meaning it is more a LGA style than BGA style.

 

Best regards,

Andreas

[Hallvard@Vitir]

Thanks, Andreas, I found all info needed in the link you sent. Great!
Best regards, Hallvard

[suri]

Advanced Quad Flat No-lead (aQFN) is a leadless, multi-row, fine pitch lead structure packaging service. With a reduced account and also small footprint, aQFN is a light weight, free-form I/O design which offers itself to boosted thermal and also electric efficiency. The aQFN bundle has a considerable expense advantage due to its affordable products and less complex product packaging procedure. vampire survivors