bootloader_secure_ble_debug_with_bonds_s140.hex test images not working

[testsweng]

Procedure

nrfjprog --recover

nrfjprog -f nrf52 --program s140_nrf52_7.0.1_softdevice.hex --sectorerase

nrfjprog -f nrf52 --reset

nrfjprog -f nrf52 --program bootloader_secure_ble_debug_with_bonds_s140.hex

nrfjprog -f nrf52 --reset

LED 1 & 2 are both on

I have used the -- chiperase option as needed for sdk153 and it does not work

The same procedure for the bootloader_secure_ble_debug_with_bonds_s140.hex file works fine.

What am I doing wrong.  I need to get this going as I am working towards buttonless

Thanks

[Vidar Berg]

Hi,

The steps to test DFU with bonds is slightly different. You need to program the application as well so bonding information can be exchange before starting DFU. See Testing Buttonless Secure DFU with bonds for exact steps. 

Note that SDK 16.0.0 with s140 v.7.0.1 support has been released.