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nRF52840 Lead Finish of the BGA Balls

John

We are having a very difficult time soldering the nRF52840 to the PCB. Our Operations Department is asking what the lead finish of the BGA balls is. Would be great to get on the phone with you guys to discuss all the things we have tried. You might have some ideas. Thank you!

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    Hi John, 

    hm.. their must be something wrong during the production, soldering, the failure rate is most decently form the IC not being properly soldered to the PCB. 
    Have you given an feedback to the production house, that the IC is not soldered properly? Then they will most likely adjust the amount of solder paste, to get the IC to sink deeper and then get better soldered to the PCB. 

    - This is not my area of expertise, but I have sent a request to our package expert, so he might have some more suggestions. 
    I will also hear with one from our test group, she's back on Monday. 

    Best regards,
    Kaja

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  • 0

    Hi John, 

    hm.. their must be something wrong during the production, soldering, the failure rate is most decently form the IC not being properly soldered to the PCB. 
    Have you given an feedback to the production house, that the IC is not soldered properly? Then they will most likely adjust the amount of solder paste, to get the IC to sink deeper and then get better soldered to the PCB. 

    - This is not my area of expertise, but I have sent a request to our package expert, so he might have some more suggestions. 
    I will also hear with one from our test group, she's back on Monday. 

    Best regards,
    Kaja

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