nRF52840-CKAA ground via

[Mike]

Referencing the recommended 52840 PCB layout for the WLCSP package, we noticed two thru-hole vias in the middle of the ground area (in the center of the package). Do these thru-hols vias create problems for the PCB manufacturing (bare board and SMT assembly)? This seems rather unconventional to add a thru-hole via in an array of pads on a 0.35mm pitch? Is this ground via backfilled with an epoxy resin or covered over to create a smooth surface for SMT assembly.

Any guidance or recommendations would be appreciated.

Thank You-

Mike Schell

[Mike]

Thank you, that makes sense. We will instruct the PCB shop to fill the through-hole vias to avoid wicking away the solder.