The solder paste stencil for mounting aQFN73

[PavelNeo]

The document infocenter.nordicsemi.com/.../nan_040.pdf shows the recommended sizes of the pads (0.275mm) and apertures for the stencil (0.3mm).
To connect the inner rows of pads in the Reference Layout www.nordicsemi.com/.../nRF52840-QIAA-Reference-Layout-1_1.zip are used vias with an outer diameter of 0.35 mm.
However, the aperture diameter in the stencil for the enlarged pads was left unchanged (0.3 mm).
Will this lead to a difficiency of solder paste on enlarged areas and, as a result, to poor-quality connection?
Please recommend the correct hole diameter in the stencil for a pads with a diameter of 0.35 mm while maintaining a hole of 0.3 mm for pads with a diameter of 0.275 mm.
Please also recommend the stencil aperture for termal pad (the vias under TP is filled).
We consider that the thickness of the stencil is 0.1 mm.

Thank you in advance.

[ketiljo]

The recommended size of pads is 0.3 mm. If you have vias in the pad, you still have to use 0.3 mm holes in the paste mark.This is with a 80 µm stencil thickness. Reduce the size of center pad with 30%

[PavelNeo]

Hi, ketiljo!

If some pads on the PCB have a diameter of 0.275 mm and others pads have a diameter of 0.35 mm, should the opening in the stencil be 0.3 mm for both pads diameters? The PCB is already made.

Best regards