Hsinchu, Taiwan, R.O.C. – September 29, 2014 : TSMC
Svenn-Tore Larsen, CEO of Nordic Semiconductor : "We have been collaborating closely with TSMC on the selection of process technology for our upcoming nRF52 Series of ultra-low power RF SoCs. I am happy to announce that we have selected the TSMC 55ULP platform. This process is a key enabler for us to push the envelope on power consumption, performance and level of integration of the nRF52 Series to meet the future requirements of Wearable and Internet of Things applications.”
Hsinchu, Taiwan, R.O.C. – September 29, 2014 : TSMC
Svenn-Tore Larsen, CEO of Nordic Semiconductor : "We have been collaborating closely with TSMC on the selection of process technology for our upcoming nRF52 Series of ultra-low power RF SoCs. I am happy to announce that we have selected the TSMC 55ULP platform. This process is a key enabler for us to push the envelope on power consumption, performance and level of integration of the nRF52 Series to meet the future requirements of Wearable and Internet of Things applications.”
