Hi,
Could you please provide me the Power Dissipation and Junction to case thermal resistance information for nRF52833-QIAA-R7
Thanks,
Joanne
Hi,
Could you please provide me the Power Dissipation and Junction to case thermal resistance information for nRF52833-QIAA-R7
Thanks,
Joanne
Hi!
So we have results showing the junction to case thermal resistance (θJC) of the package when applying different thermal power dissipation.
Here are those results:
Total power (W) - θJC (°C/W)
0.1 - 14.12
0.2 - 14.15
0.3 - 14.15
0.4 - 14.15
However, since the chip doesn't require cooling fins, the junction to case value isn't really relevant.
Regarind the power dissipation, it really depends on the SW running on the IC so we can't give a general number. For this, you should measure on your own IC running your application.
Let me know if this answered your question!
Best regards,
Heidi