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Large * .bin bootloader output file

Hello!
I need to migrate the loader project from SDK15.3 to 16.0.
The SES project parameters are as follows:

FLASH_PH_START = 0x0
FLASH_PH_SIZE = 0x80000
RAM_PH_START = 0x20000000
RAM_PH_SIZE = 0x10000
FLASH_START = 0x65000
FLASH_SIZE = 0x11200
RAM_START = 0x20002ad8
RAM_SIZE = 0xd528

In SDK 16/17 in the file nrf_mbr.h I see this
#define MBR_BOOTLOADER_ADDR (0xFF8)
#define MBR_PARAM_PAGE_ADDR (0xFFC)
I also see in the nrf_bootloader_info.c file
#define UICR_BOOTLOADER_ADDR 0x10001014
But it is not used in the __SES_ARM compiler

And here the fun begins. If the flash_placement.xml file for SDK 15
name = "uicr_bootloader_start_address" start = "0xFF8"
name = "uicr_mbr_params_page" start = "0xFFC"
and I leave these values, then the size of the output * .bin file is normal - 45 KB (of course, it does not work, most likely mbr is overwritten), but if I enter new values ​​in the format of SDK 16/17
name = "uicr_bootloader_start_address" start = "0x10001014"
name = "uicr_mbr_params_page" start = "0x10001018"
Then I get the size of * .bin file 261 745 KB. Clearly a memory error.

What to do?

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