Hi, I'm referring to this post over 3 years ago: Nordic DevZone (nordicsemi.com)
I'm using Android 8.0, and I'm using SDK 12.3.0 for firmware. I'm trying to create bond to a device. Everything worked fine when the bond was first created, but after I disconnected it, I couldn't connect it back. I referred to ble_app_hids_keyboard example and set the connection parameters the same as theirs, but it still didn't work. Here are some configuration of connection parameters I set:
#define MIN_CONN_INTERVAL MSEC_TO_UNITS(7.5, UNIT_1_25_MS) /**< Minimum acceptable connection interval (7.5 ms), Connection interval uses 1.25 ms units. */ #define MAX_CONN_INTERVAL MSEC_TO_UNITS(30, UNIT_1_25_MS) /**< Maximum acceptable connection interval (30 ms), Connection interval uses 1.25 ms units. */ #define SLAVE_LATENCY 6 /**< Slave latency. */ #define CONN_SUP_TIMEOUT MSEC_TO_UNITS(430, UNIT_10_MS) /**< Connection supervisory timeout (4 seconds), Supervision Timeout uses 10 ms units. */ #define FIRST_CONN_PARAMS_UPDATE_DELAY APP_TIMER_TICKS(5000, APP_TIMER_PRESCALER) /**< Time from initiating event (connect or start of notification) to first time sd_ble_gap_conn_param_update is called (5 seconds). */ #define NEXT_CONN_PARAMS_UPDATE_DELAY APP_TIMER_TICKS(30000, APP_TIMER_PRESCALER) /**< Time between each call to sd_ble_gap_conn_param_update after the first call (30 seconds). */ #define MAX_CONN_PARAMS_UPDATE_COUNT 3 /**< Number of attempts before giving up the connection parameter negotiation. */
The min and max connection interval was 20ms and 75ms, and the slave latency was 0, and those parameters didn't work either. Does anyone have any suggestions about how I should deal with all these issues? Thanks!
