Hi,
For board assembly process evaluation, what is the coplanarity specification for nRF9160 module? I.e. how much its bottom surface can be twisted/bended from the ideal plane? This parameter is typically specified for same kind of bigger components.
Br, JuhaK
Hi!
The coplanarity specification criteria for the nRF9160 SiP is max 60 μm.
The report on the nRF9160-SICA-B1 shows maximum at 15 μm (3 lots of 10 measured), see the table I've attached below.
Let me know if there's anything else I can do for you!
Best regards,
Heidi
Hi!
The coplanarity specification criteria for the nRF9160 SiP is max 60 μm.
The report on the nRF9160-SICA-B1 shows maximum at 15 μm (3 lots of 10 measured), see the table I've attached below.
Let me know if there's anything else I can do for you!
Best regards,
Heidi
