What should be considered for choosing a chipset?

[Samira]

What should be considered for choosing a chipset? the followings are in my mind. Could you please tell me if I am correct and if I should consider anything else too.

1) size of a chip?

2) Tx power?

3) ATT MTU?

4) How many peripheral devices could be supported?

5) Number of packets for each connection interval?

[Sigurd]

Hi,

Here is a list over some things that you might need to consider:

Amount of Memory (Flash/RAM) needed – more complex applications require more memory

Digital interfaces/Hardware peripherals – do you need NFC, USB, SAADC, PWM, I2S, QSPI, etc

Radio protocols – BLE 2 Mbps, Long range, Thread , BLE Mesh, IEEE 802.15.4

Radio output power – +8dBm needed?

Power management - supply voltage range, battery powered, powered from USB, etc

How many GPIOs are needed?

Package variant

Temperature

See this link - > https://infocenter.nordicsemi.com/topic/struct_nrf52/struct/nrf52.html

1) size of a chip?

 Yes, -> Package variant

2) Tx power?

 Yes

3) ATT MTU?

 No, all our BLE stacks for nRF52 series supports long ATT MTU.

4) How many peripheral devices could be supported?

Yes, supporting multiple devices to be connected at the same time requires more flash/RAM

5) Number of packets for each connection interval?

For a 1-to-1 connection then the chip you use does not affect this much, but if you need to buffer a lot of data, or you have multiple connections at the same time, then more RAM will be useful.

[Samira]

Thank you so much for your reply.

1) if the device support BLE Mesh, does it mean that it supports  Low-power IP (IPv6/6LoWPAN)? 

2) what is the temperature? could you please explain about it? the chip should be residence for higher temperature? or is it only a sensor to sense temprature and sends the data?

[Sigurd]

1)

No, BLE Mesh is not IPv6 based. For IPv6/6LoWPAN I recommended Thread protocol.

nRF5 SDK: https://www.nordicsemi.com/Software-and-tools/Software/nRF5-SDK-for-Thread-and-Zigbee

nRF Connect SDK: https://developer.nordicsemi.com/nRF_Connect_SDK/doc/1.5.1/nrf/ug_thread.html

2)

Samira said:

the chip should be residence for higher temperature?

 Yes, e.g. nRF52833 has max operating temperature at 105°C

[Samira]

I have also another question, are the Link Layer and Physical Layer in Bluetooth stack related to the hardware  and are the rest layers (L2CAP, GATT, GAP and etc.) software part?