We are hearing solder bridge issues on the NRF52832-QFAA:
"Due to the high thickness of the copper layer and small lead spacing on the component, the boardshops are not able to add soldermasks around the pads of this component. Because of this when trying to solder all of the leads, there is no soldermask to block two pads from soldering together causing a solder bridge. This is occurring in ~20% of the jobs."
Has anyone else came across this? Other than going to 1oz (not achievable with our power traces) or putting the chip on a daughter card ($$), what are some recommended fixes or ideas?
Any insight is appreciated! Thanks!