WLCSP nRF52832

[eck]

Hi,

we are designing a module with the nRF52832 WLCSP. As the module will be soldered on a motherboard a second soldering process respectively a thermal exposure will take place, so following the Application Note nAN-038 "WLCSP Handling guidelines" Solder Mask Defined Pads are recommended. What Dimensions are recommended? Would a Soldermask Opening of 215 µm, and a Copper Pad of 300µm suit?

[bjorn-spockeli]

Please see this thread.

-Bjørn

[RK]

I hadn't even seen the specs/pinout for the WLCSP nrf52832, they're not in the current objective spec online, where are they?

[bjorn-spockeli]

I apologize for my slow response RK. As you pointed out they're not in the OPS, but we will release the specs/pinout for the WLCSP in a standalone document.

[bjorn-spockeli]

Please see this post for the preliminary pinout/spec for the nRF52832 WLCSP.