Hi,
we are designing a module with the nRF52832 WLCSP. As the module will be soldered on a motherboard a second soldering process respectively a thermal exposure will take place, so following the Application Note nAN-038 "WLCSP Handling guidelines" Solder Mask Defined Pads are recommended. What Dimensions are recommended? Would a Soldermask Opening of 215 µm, and a Copper Pad of 300µm suit?