Hello,
is there any guidance on how to solder the balun?
As it "sinks" while soldering, and I'm not sure if it is a "normal state".
Thank you Oleh
Hello,
is there any guidance on how to solder the balun?
As it "sinks" while soldering, and I'm not sure if it is a "normal state".
Thank you Oleh
That would be normal for a BGA/WLCSP device, the balls will collapse when soldered. For prototypes I would just put flux on the pads rather than using solder paste as it's easy to get shorts when using solder paste for small pitch BGA devices. Also, use ENIG surface PCBs rather than HASL, the uneven surface level with HASL can make the soldering very unreliable.
Dear Janek,
thank you for your advice and answer!
The PCB is ENIG-surfaced. Will try it again!
Thanks&Cheers Oleh
Hello,
You can also have a look to application note AN2348 on www.st.com, which gives soldering recommandations.
Best Regards Richard
Richard thank you for your reply.
I must have had a blackout: have read this AN, but at some point...
Thank you! with best regards Oleh