• State Verified Answer
  • Replies 4 replies
  • Subscribers 64 subscribers
  • Views 2038 views
  • Users 0 members are here
Attachments (0)
Nordic Case Info
  • Case ID: 101563
Options
This post is older than 2 years and might not be relevant anymore
More Info: Consider searching for newer posts

Soldering BAL-NRF01D3

Oleh

Hello,

is there any guidance on how to solder the balun?

As it "sinks" while soldering, and I'm not sure if it is a "normal state".

Thank you Oleh

Parents
  • 0

    That would be normal for a BGA/WLCSP device, the balls will collapse when soldered. For prototypes I would just put flux on the pads rather than using solder paste as it's easy to get shorts when using solder paste for small pitch BGA devices. Also, use ENIG surface PCBs rather than HASL, the uneven surface level with HASL can make the soldering very unreliable.

Reply
  • 0

    That would be normal for a BGA/WLCSP device, the balls will collapse when soldered. For prototypes I would just put flux on the pads rather than using solder paste as it's easy to get shorts when using solder paste for small pitch BGA devices. Also, use ENIG surface PCBs rather than HASL, the uneven surface level with HASL can make the soldering very unreliable.

Children
Related