Bonding problem

[Mohamed O.Abouzeid]

Hello guys,

I'm working in a project which requires from me to bond to certain devices and refuse the bonding from others, I mean at certain input, connect to anyone and accept pairing from any device and at certain input, connect only to previously paired devices only, My problem is that the behaviour of the development kit is good but when I'm using this module PTR51822A, I faced a lot of issues and I cannot understand why its doing like that and it's totally random,it's not depending on the condition I'm putting because when I checked it with ble sniffer, it gives me weird results , for example:

why the telephone keeps sending too much packets with no waiting for the module to respond to it? these cases never ever happened with the development kit and it's the same code running in both chips.

and also sometimes after trying to bond, master is not responding to the slave and after timeout it looses the connection and start advertising again which is not expected to do.

I'm saying it's really weird because all my devices are able connecting to the same module and they are also at certain time with the same conditions, didn't connect to the module, I don't know why but I'm attaching six sniffer files, one is the working case and the others are not working for different reasons.

snifferResults.rar

I'm trying my module with LG , Hauwei mediapad m2, Iphone 4s, Ipad 10.

thanks for help.

Regards,

Mohamed Osama

[Mohamed O.Abouzeid]

any help please !!!

[Hung Bui]

What you observed usually happens when the firmware on the chip crashes and got restarted. You see the master keep transmitting but it's not "keeps sending two much packets with no waiting for the module to respond ". It's simply resend the packet be cause the slave didn't response to it.

What you need to do is to figure out why the system crash, you can follow the debug guide here.

I suspect it has something to do with how you handle bonding, the last command from the central to the peripheral is a pairing request.

[Mohamed O.Abouzeid]

@HungBui, it's already inside the package, I don't know how to debug it while it's in the package, but it didn't happen with the development kit, if you've time and looked at the six files I'm attaching, you will find that it sometimes do it independtly of pairing or anything, it's just try to connect, then terminate it.

I don't know how to replicate this case in the DK because it's already the same code burnt to DK and the modules.

[Hung Bui]

@mohamed: You mean you have no access to the programming interface ? Have you tested the device before you deploy it ?

How different the board is compare to the DK ?

Which exactly the trace you want me to have a loot at ?

Made sure you erase all bond before you test the device.

[Mohamed O.Abouzeid]

@hungbui, in the question, I'm attaching 6 different sniffer trace data, at different points, it didn't complete the connection, I don't know what is the reason for that. it has no big difference, only the PTR51822a module is used and in the DK, it's only the chip. you mean erase all bonds from the module, if it's already bonded to one of the phone, it should accept connection after that even if I erased the bond information from the phone.