Bonding problem

[Mohamed O.Abouzeid]

Hello guys,

I'm working in a project which requires from me to bond to certain devices and refuse the bonding from others, I mean at certain input, connect to anyone and accept pairing from any device and at certain input, connect only to previously paired devices only, My problem is that the behaviour of the development kit is good but when I'm using this module PTR51822A, I faced a lot of issues and I cannot understand why its doing like that and it's totally random,it's not depending on the condition I'm putting because when I checked it with ble sniffer, it gives me weird results , for example:

why the telephone keeps sending too much packets with no waiting for the module to respond to it? these cases never ever happened with the development kit and it's the same code running in both chips.

and also sometimes after trying to bond, master is not responding to the slave and after timeout it looses the connection and start advertising again which is not expected to do.

I'm saying it's really weird because all my devices are able connecting to the same module and they are also at certain time with the same conditions, didn't connect to the module, I don't know why but I'm attaching six sniffer files, one is the working case and the others are not working for different reasons.

snifferResults.rar

I'm trying my module with LG , Hauwei mediapad m2, Iphone 4s, Ipad 10.

thanks for help.

Regards,

Mohamed Osama

[Mohamed O.Abouzeid]

I'm using S110 anyways, but at the workingcase file, at packet 263, it's the same behaviour and the response of the master was different,

I don't understand what the revision will do with supporting s130 or something else.

another thing, I'm debugging the case again with nordic development kit, an arbitrarily crash pop up at file name in hexadecimal view(0x0001AB9C) which means that most probably the arbitrarily behaviour may be because of that crash.