nrf52832 footprint design

[Gavin]

Hi - I am designing some boards using the NRF52832 and would like to check a couple of things about footprint design. Unfortunately I don't have access to Altium, and am therefore dependent on the pdfs of your reference design.

1. the large ground pad on the top copper layer does not have any holes in it, yet the bottom one does. Am I right to assume that the holes go all the way through the board to act as stitched vias?
2. should the vias be tented on the underside?

Thanks for any advice

Gavin

[Hung Bui]

Hi Gavin,

You can use the Altium Designer Viewer, it's free.
Or you can use any Gebber viewer to open the Gerber files.

When you open using Altium, you can see the hole go through top layer (how could it be not if it's 2 layers PCB ?) I will check with my coworker to see why we have a solid pane in the pdf.

2. I don't think tenting needed.The pad acts as GND contact and heat sink.

[Hung Bui]

Update on 2) If you are talking about the bottom layer then tenting is good.

[Gavin]

Many thanks for the quick response - v helpful