Hi - I am designing some boards using the NRF52832 and would like to check a couple of things about footprint design. Unfortunately I don't have access to Altium, and am therefore dependent on the pdfs of your reference design.
- the large ground pad on the top copper layer does not have any holes in it, yet the bottom one does. Am I right to assume that the holes go all the way through the board to act as stitched vias?
- should the vias be tented on the underside?
Thanks for any advice
Gavin