Hello,
In the reference layout for NRF52840 package (QIAA), the shape defined in the SOLDER PASTE is a bit larger than the one defined on TOP LAYER (copper) for each terminal pad. Is it normal and what's the point of it ?
Hello,
In the reference layout for NRF52840 package (QIAA), the shape defined in the SOLDER PASTE is a bit larger than the one defined on TOP LAYER (copper) for each terminal pad. Is it normal and what's the point of it ?
The reference layout is correct, the solder paste has to be larger than the top copper to avoid that the solder paste covers the copper. It can be useful to have a look at this "blog" post regarding the same topic.
The reference layout is correct, the solder paste has to be larger than the top copper to avoid that the solder paste covers the copper. It can be useful to have a look at this "blog" post regarding the same topic.